CGI Core Product & Biz Opportunity

Core technology	Technological competitiveness		Heat output per unit area(w/㎠)			Current application industry	Expansion business group
			Low (~20)	Mid (20~70)	High (70~150)
Qread™	① Ultra-thin printing/material diversification	- Ultra-thin plate/non-directional/material diversity - 14 patents, 4 trademarks	●	●		EV battery field Display field (Mobile, TV, NotePC)	All fields of ICT equipment
TGP™	② High fever group	- Thin/flat-free - World Patent/International License - Special coating (cost competitiveness)		●	●	Power semiconductor field(IGBT)	ESS (PCS) field State-of-the-art equipment (medical and military)
HCCS™	③ System design technology	- Maximize heat dissipation efficiency - Simplification of heat dissipation system structure	●	●	●	Communication equipment field (repeater, router) Electric Vehicle Field (PE Cooling)	EV charger field Semiconductor equipment field

※ Sustainable growth of the company can be maintained by expanding the market through continuous R&D investment based on the core product

Development of CGI Core Technology

Securing specialized “heat dissipation system design and mass production technology” based on the developed core products (Qread™, TGP™).
Heat dissipation system repeater · It is possible to expand the scope to the business of providing “heat dissipation system solution” such as automotive PE heat dissipation module. Design and mass production technology.

Development of technology
① Ultra-thin plate (light weight) · Diversification of materials	② High heat group heat dissipation technology	③ System design and analysis technology
Maintaining the manufacturing technology gap → Implementation of the world's first 0.3T thickness  → Cu, STS, AL, Ti Apply various materials Advancement of container bonding technology (process technology) → Laser welding, fill tube not applied	70~150w/㎠ High heat group heat dissipation technology International patent license Among high-heat heat-dissipating products, the minimum thickness is 1.5T → Lightweight and cost competitiveness	Provide heat dissipation system solution → V/C+Product (combined product) design/analysis Securing thermal performance prediction and verification capabilities → In house V/C performance prediction program (prediction accuracy 95% level)

Technical products
For Samsung Electronics Mobile V/C Heat pipe for Samsung Electronics TV V/C for Samsung Electronics Notebook V/C for heat dissipation of Hyundai Motor's electric vehicle battery	Infineon TGP™ for power semiconductor/ESS TGP™ for SIEMENS Ultrasound Medical Device	Samsung Electronics 5G Repeater Hyundai car PE Cooling System Samsung SDI Cylindrical Battery Cooling V/C Grikin Semiconductor Equipment Parts (Target) Signet EV Charger System