TGP™
High heat dissipation high heat product vapor chamber - TGP™ (Thermal Ground Plane)
What is TGP™?
New concept vapor chamber (V/C) with international patent license applied to high heat (70W/㎠ or more) group
Applications
Power semiconductor (PCS field), state-of-the-art equipment (medical equipment and military equipment field)
Product competitiveness
Lightweight (weight reduction by 50% or more) and cost competitiveness (reduction by more than 50%) by applying special coating technology (capillary structure not applied)
In the condition of 50W/cm2 or more V/C rapidly increases the thermal resistance, whereas in the case of TGP™, the thermal resistance continues to decrease.
Depending on the installation direction V/C is affected by thermal resistance, but TGP™ does not change according to direction..
